The Chinese company Xiaomi unveiled the new generation of its Xring O3 smartphone processor, in a move aimed at strengthening its control over the main components of its devices and reducing its dependence on external chip suppliers.
The launch of the new processor comes about a year after the launch of the Xring O1, the first smartphone processor developed by Xiaomi, as part of the efforts of the third largest smartphone company in the world to catch up with competitors such as Apple, Samsung, and Huawei, which develop custom chips for their devices.
Reuters reported that the Chinese company was able to sell nearly 150,000 phones using its first processor since its launch in May 2025.
Two informed sources told Reuters that TSMC Semiconductor Manufacturing Company in Taiwan is producing the new processor using 3-nanometer manufacturing technology.
The Xring O3 processor is based on 3-nanometer manufacturing technology, and includes a central processing unit with a design based on 10 high-performance cores.
According to information announced by Xiaomi, the performance of the multi-core processor exceeded 15 thousand points, with an increase of up to 60% compared to the previous generation.
The processor uses the new G2-Ultra NX graphics processing unit, which Xiaomi says provides an 85% increase in graphics performance, while reducing power consumption by up to 64%.
The company indicated that the Xring O3 is the first phone processor to support LPDDR6 memory, with a bandwidth of up to 113.8 GB per second, an increase of 48% over the first generation Xring O1.
The processor achieved 5.22 million points on the AnTuTu performance testing platform, according to Xiaomi’s results, becoming the first phone processor to exceed the barrier of 5 million points on the platform. These results remain figures announced by the company, pending independent tests of commercial devices.
